EMI Shielding Products
Conductive Adhesives
description2
Silicone conductive adhesive
Silicone conductive adhesive is a single-component conductive adhesive that cures at room temperature and is made of conductive particles. It cures quickly after contact with air at room temperature to form an elastic conductive adhesive joint or sealing gasket with excellent adhesion, conductivity, and good physical and mechanical properties. Commonly used conductive fillers include silver, copper-plated silver, glass-plated silver, aluminum-plated silver, and graphite-plated nickel.
Technical Parameters
|
Product Model |
DS-00053 |
DS-00057 |
DS-57151 |
DS-57030 |
DS-00059 |
DS-00055 |
DS-62113 |
|
Base material |
Silicone resin |
Silicone resin |
Silicone resin |
Silicone resin |
Silicone resin |
Silicone resin |
Silicone resin |
|
Filler |
silver |
Silver/Copper |
Silver/Copper |
Silver/Copper |
Silver/Aluminum |
Silver/Glass |
Nickel/Carbon |
|
Apparent specific gravity |
3.06±0.13 |
3.7±0.2 |
3.6±0.13 |
3.75±0.25 |
2.0±0.25 |
1.9±0.1 |
2.6±0.13 |
|
Operation time |
5 minute |
15 minute |
25 minute |
0.5 Hour |
0.25 Hour |
0.5 Hour |
25 minute |
|
Curing time h |
72 |
168 |
168 |
168 |
168 |
72 |
168 |
|
Volume resistivity Ω cm |
≤0.005 |
≤0.008 |
≤0.01 |
≤0.05 |
≤0.01 |
≤0.05 |
≤0.5 |
|
Lap shear strength MPa |
≥1.03 |
≥1.30 |
≥1.03 |
≥1.38 |
≥0.69 |
≥0.69 |
≥0.69 |
|
Silicon-aluminum peel strength PPi |
≥2 |
≥2.5 |
≥3 |
- |
- |
≥2 |
≥3 |
|
Temperature range ℃ |
-55～+200 |
-55～+125 |
-55～+125 |
-55～+180 |
-55～+200 |
-55～+180 |
-55～+125 |
|
Recommended coating thickness mm |
No less than 0.13 |
0.25 |
- |
0.25 |
0.25 |
0.18 |
- |
|
Specification g |
56 |
56/113 |
56 |
56/113 |
56 |
56 |
56 |
|
Storage period moon |
6 |
6 |
9 |
9 |
6 |
6 |
6 |
Product Performance
①Pure silver conductive silicone grease (DS-00053): The conductive silicone grease with the strongest shielding effectiveness and the strongest temperature adaptability, which can withstand high temperatures of 200°C.
②Copper-plated silver conductive silicone grease (DS-00057): It has the best conductivity and stronger adhesion (second only to DS-01030) among the same materials. It is the most commonly used conductive silicone grease.
③ Conductive putty (DS-57151): The thinnest conductive silicone grease. Suitable for electrical connections in irregular gaps and narrow spaces. Suitable for improving the integrity of all electronic housing interfaces or holes.
④Copper-plated silver conductive silicone glue (DS-57030): The conductive silicone glue with the strongest bonding force, the lap shear strength is not less than 1.38MPa; it has the strongest temperature adaptability among similar materials and can withstand high temperatures of 180°C. Note that this product is only conductive in the vertical direction.
⑤Aluminum-silver-plated conductive silicone grease (DS-00059): High shielding efficiency, more compatible with aluminum-silver-plated conductive pads. Low density, suitable for applications that have strict requirements on equipment weight and high shielding effectiveness.
⑥Glass silver-plated conductive silicone grease (DS-00055): Lowest density, best performance-price ratio. Suitable for communication field and general military occasions. This product is not suitable for high-frequency vibration occasions.
⑦ Graphite nickel-plated conductive silicone grease (DS-62113): low price, good electrochemical compatibility with aluminum, suitable for general military products.
Instructions
Bonding surface preparation: First use primer or alcohol to clean the metal surface to be bonded, and wait until it is dry before starting to coat.
Features
●Prevent interference from external electromagnetic fields and leakage of internal electromagnetic information.
●Achieve conductive connection and environmental sealing between the conductive pad and the device.
●Suitable for securing EMI shielding gasket feed-through assemblies.
●Achieve conductive connection between shielding glass or electromagnetic shielding ventilation window and flange housing.
●Fixed conductive rubber gasket in the groove of the chassis or cover or as a conductive sealant in the gap.
Application Areas
It is widely used in electronic equipment and instruments, testing equipment, portable equipment and calibration equipment in the fields of communication engineering, aerospace, radar systems, consumer electronics, health care, etc., to achieve conductive connection, flexible bonding and environmental sealing between conductive rubber and metal or between conductive rubber and conductive rubber, such as connecting conductive rubber strips, fixing EMI shielding gaskets, gap filling, etc.
Epoxy conductive adhesive
Two-component epoxy conductive resin adhesive is a mixture of high bonding strength epoxy resin and highly conductive particles. It has many advantages such as high bonding strength, excellent conductivity, wide temperature range, and easy operation. It can be cured at room temperature or high temperature to form a solid structure connection and meet most strict electrical requirements. It can replace solder for bonding electronic components and printed circuit boards, glass, and ceramics; packaging of integrated chips, circuit boards, capacitors, and other components; and bonding photovoltaic panels.
Technical Parameters
|
Product Model |
DS-HY-584-29 |
DS-HY-57-250 |
DS-HY-H20E |
|
filler |
silver |
Silver/Copper |
silver |
|
Mixing ratio |
100:6.3 |
1:1 |
1:1 |
|
proportion |
2.5±0.2 |
3.7±0.2 |
2.67±0.2 |
|
Weight(g) |
1/2.5/10 |
250 |
10/30/50 |
|
Body resistance Ω cm |
≦0.002 |
≦0.01 |
≦0.0004 |
|
Silicon-aluminum peel strength KN/mm |
- |
6.95*103 |
- |
|
Minimum lap shear strength, MPa |
8.28 |
8 |
10.17 |
|
Operating temperature(℃) |
-55～+125 |
-55～85 |
-55～200 |
|
High temperature curing cycle |
15 Minutes (113°C) |
30 Minutes (120°C) |
5 Minutes (150°C) |
|
Room temperature curing cycle |
twenty four Hour |
48 Hour |
- |
|
Operation time (hours) |
0.5 |
0.5 |
8 |
|
Storage period (month) |
9 |
9 |
12 (23°C) |
|
Coating area (cm²/g) |
150 |
120 |
150 |
|
Recommended thickness (mm) |
0.025 |
0.3～0.5 |
|
Product Performance
DS-HY-584-29: It combines the properties of room temperature curing and low viscosity, and can replace soft soldering or electric welding to a certain extent. There are three specifications of 1 gram, 2.5 grams and 10 grams for customers to choose from.
DS-HY-57-250: is a low-cost, easy-to-mix adhesive/sealant with high lap shear strength. Used to fill larger gaps and has good thermal shock damping.
DS-HY-H20E: It is a two-component, 100% solid silver-filled epoxy adhesive designed for bonding electronic chips and optoelectronic applications. Due to its high thermal conductivity, this product is also used in thermodynamics.
Instructions
Operation process: The metal surface to be bonded is roughened with coarse sandpaper, and then the surface is cleaned with acetone or other cleaning agents. After the cleaning agent evaporates, the glue is evenly applied to one metal surface to be bonded (completely coated). Then, it is bonded to the other metal surface to be bonded and pressure is applied to cure.
①DS-HY-584-29 When using, pull off the red rod in the middle and mix the materials on both sides evenly before use. The bonding surface must be clean, and the conductive adhesive can be applied by a variety of methods such as scraper, needle tube, etc.
②When using DS-HY-57-250, take out components A and B respectively, mix them evenly in a container, and then apply and bond. If the product has been stored for a long time, it needs to be preheated in a 30℃ oven to soften it before use, and then stir components A and B evenly respectively before mixing them for use.
③DS-HY-H20E Before mixing components A and B, mix components A and B separately. The curing methods include: box furnace baking, electron tube tunnel furnace, heating gun, heating plate, infrared, convection or sensor coil. The curing time is: 45 seconds at 175℃, 5 minutes at 150℃, 15 minutes at 120℃, 2 hours at 100℃, and 3 hours at 80℃ (DS-HY-H20E can still be frozen and stored at -40℃ for one year without failure after premixing).
Features
●Excellent electrical conductivity
●Low curing shrinkage and high bonding strength
●Good chemical resistance and environmental adaptability
Application Areas
It is mainly suitable for various electronic consumer products, communication equipment, automotive parts, medical equipment and other printed circuit board wire connections, microwave component lead connections, fixed connections between metal wire mesh and shielding pads and other applications that require hard surface conductive bonding. It can simultaneously achieve the dual functions of conduction and bonding.