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Mndandanda wa 2024 Global Best Sensor Awards

Nkhani Zamakampani

Mndandanda wa 2024 Global Best Sensor Awards

2024-08-09

M'mawa wa June 26 (masana a June 25, nthawi yakomweko ku United States), panthawi ya Sensors Converge (yomwe kale inali Sensor Expo), imodzi mwa ziwonetsero zazikulu zitatu zapadziko lonse lapansi, okonza Sensors Converge ndi Fierce El.Ectronics adalengeza mndandanda wa 2024 Best of Sensors Awards.

Chochitika chosankha Mphotho Yabwino Kwambiri ya Sensor chakhala chikuchitika kwa zaka 30, kuyang'ana kwambiri zinthu zabwino kwambiri komanso zotsogola kwambiri, matekinoloje, magulu ndi anthu omwe ali mumakampani opanga ma sensor. Cholinga chake ndi kuzindikira ndi kulimbikitsa kuzindikira kofala kwa matekinoloje ndi magulu omwe amasintha kwambiri makampani. Opambana amasankhidwa ndi oweruza a akatswiri kutengera mtengo wa chinthu kapena munthu pamsika, mavuto omwe amathetsa kapena zovuta zomwe zimathetsa, komanso mawonekedwe apadera.

Omaliza Mphotho Yabwino Kwambiri ya 2024:

Kuphunzira kwa AI/Makina
Lam Research Equipment Intelligence® Solutions ndi Lam Research
 
Zagalimoto / Zodziyimira pawokha
Sonair - Wopambana 3D Akupanga Sensor kwa Autonomous Robotics ndi Sonair
ku
Cleantech/Sustainability
LAYER®Vault ndi Dracula Technologies
ku
Kulumikizana
Blecon: Kuthandizira Kulumikizana kwa Sensor IoT ndi Bluetooth Low Energy ndi Blecon
ku
Edge Technology
Kugwiritsa Ntchito Zowoneka Pogwiritsa Ntchito AI Pamphepete ndi MAX78000 Microcontroller ndi Analog Devices
ku
Makompyuta Ophatikizidwa
Snapdragon X Elite Platform yolembedwa ndi Qualcomm Technologies, Inc.
ku
Industrial & Production
Next Generation High Precision 6DoF Inertial Sensor for Industrial Applications yolembedwa ndi Murata Electronics
 
IoT
NOVELDA X7 Ultra-Low Power Presence Sensor yolembedwa ndi Novelda AS
 
MEMS
Gulu Loyamba Loyenda Padziko Lonse, Multi-Axis, Chip Scale MEMs 3 Axis Accelerometer yolembedwa ndi MEI Micro, Inc.

Optical & Imaging
VD55G1 sensor kamera ndi STMicroelectronics

Mphamvu
Batire ya EnerCera yowonjezeredwa ndi NGK Insulators, LTD.

Zamankhwala & Zovala
ZenVoice Bone: Ultimate Noise Reduction Algorithm ya TWS Earbuds yolembedwa ndi AiZip & Bosch
 
Omaliza Mphotho Yake ya 2024 ndi:

Executive of the Year
Alissa M. Fitzgerald, PhD, Woyambitsa ndi CEO, AMFitzgerald

Mkazi wa Chaka
Rosa Chow, Wachiwiri kwa Purezidenti wa Software Engineering, TDK Corporation

Kutuluka Nyenyezi
Charlotte Savage-Pollock, Woyambitsa & CIO, HaiLa Technologies Inc.

Kuyamba kwa Chaka
Malingaliro a kampani HaiLa Technologies, Inc.

Company of the Year
Microchip Technology


Chidziwitso chamakampani opambana a sensor ndi zinthu (Gawo 1)

Kafukufuku wa Lam
Kuphunzira kwa AI/Makina
Lam Research Equipment Intelligence® Solutions ndi Lam Research

Lam Research0u7


Lam Research Corporation ndi waku America wogulitsa zida zopangira zophikidwa ndi ntchito zofananira kumakampani opanga zida zamagetsi. [2] Zogulitsa zake zimagwiritsidwa ntchito makamaka pakukonza kophika kutsogolo, komwe kumaphatikizapo masitepe omwe amapanga zigawo zogwira ntchito za zida za semiconductor (transistors, capacitors) ndi mawaya awo (zolumikizana). Kampaniyo imamanganso zida zopangira ma back-end wafer-level packaging (WLP) komanso misika yofananira yopangira zinthu monga microelectromechanical systems (MEMS).

Chinthu chopambana ndi Lam Research Equipment Intelligence® Solutions, chomwe chimathandiza makasitomala kufulumizitsa kusintha kwaukadaulo pamtengo wotsika, osagwiritsa ntchito zinthu zochepa, ndikuchepetsa zinyalala. Kuti izi zitheke, kuwonjezera pa kufulumizitsa R&D kuti muwongolere magwiridwe antchito a chipangizocho, m'pofunikanso kupeza njira zopezera kupanga kwapamwamba kwambiri (HVM) pamtengo wotsika. Equipment Intelligence® ili ndi ma modules anayi - ulusi wa digito / ulusi wa digito, chitukuko cha ndondomeko, zipangizo zamakono ndi ntchito zamakono - zomwe zingaphatikizepo ma data modelling, virtualization ndi intelligence intelligence (AI) m'mbali zonse za kupanga, kupanga, kugula, kumanga ndi kuthandizira machitidwe ndi njira, kuchokera ku lingaliro kupita ku kafukufuku wotheka kupita ku HVM.


Sonair
Zagalimoto / Zodziyimira pawokha
Sonair - Wopambana 3D Akupanga Sensor kwa Autonomous Robotics ndi Sonair
 
Sonairpf9

Yakhazikitsidwa mu 2022, Sonair amagwira ntchito pa masensa akupanga omwe amachepetsa zovuta zachuma zomwe zimagwirizanitsidwa ndi magalimoto oyendetsedwa ndi automated (AGVs) ndi autonomous mobile robots (AMRs). Kampaniyo imati pogwiritsa ntchito ukadaulo wopangidwa ku SINTEF MiNaLab ku Europe, masensa ake amatha kupititsa patsogolo masomphenya a loboti kuyambira 2D mpaka 3D, kusintha kwakukulu pamakina achikhalidwe ndi makamera.

Njira yojambula yopambana mphoto ya 3D ultrasonic sensor ndi luso lopanga beamforming, lomwe ndilo maziko a sonar ndi radar komanso kukonza zojambula zachipatala za ultrasound. Sonair imaphatikiza mafunde ofananira ndi akupanga Transducers yokhala ndi mapulogalamu apamwamba kwambiri opangira ma beamform ndi ma aligorivimu ozindikira zinthu kuti apeze zambiri zamitundu itatu pamtengo wotsika. Sonair akufotokoza sensa yatsopano ya 3D ultrasonic ngati njira ina yopangira ma lidar (LiDAR) okwera mtengo, ndipo kampaniyo ikuyembekeza kuti 3D ultrasonic sensor idzagulitsidwa pa 50% mpaka 80% ya mtengo wa masensa a lidar.

Kupambana Kwambiri kwa 3D Akupanga Sensor ya Autonomous Roboticsohi

Dracula Technologies
Cleantech/Sustainability
LAYER®Vault ndi Dracula Technologies

Dracula Technologiesmur
Dracula Technologies ndi gulu loyambira ku France lomwe linakhazikitsidwa mu 2011 kutsatira pulojekiti yomwe inapangidwa ndi bungwe lofufuza za anthu CEA (Commissariat à l'énergie atomique et aux énergies alternatives, kapena French Alternative Energies and Atomic Energy Commission). Mtsogoleri wamkulu wa Brice Cruchon adawona kuthekera kwamalonda kwaukadaulo, ndipo patatha zaka zisanu ndi chimodzi zafukufuku ndi chitukuko, LAYER adayambitsa kuyambitsa kwaukadaulo kudzera pa pulogalamu ya "Moni Mawa".

LAYER® Vault yopambana mphoto, Dracula amagwiritsa ntchito ukadaulo wa organic photovoltaic (OPV, kapena organic solar cell) womwe umapezeka mu osindikiza a inkjet kuti apange magetsi luso. Ma module a OPV, otchedwa LAYER (kapena Light As Your Energetic Response), amayendera m'nyumba pa kuwala kwachilengedwe kapena kochita kupanga ndipo atha kugwiritsidwa ntchito kuyatsa zida zamkati zomwe sizimamwa kwambiri. Chifukwa amasindikizidwa, m'malo mopangidwa ndi silicon, mawonekedwe a ma module a OPV amasinthidwa mosavuta, ndipo mosiyana ndi mabatire ambiri, sagwiritsa ntchito nthaka yosowa kapena zitsulo zolemera. M'malo mwake, ma modules amapangidwa ndi zipangizo za carbon.

Dracula Technologies yalowa mumgwirizano ndi SemTech yemwe amagulitsa ndalama, yomwe imapereka ma semiconductors, machitidwe a IoT ndi mautumiki olumikizira mitambo. Chipangizo cha LayerVault chimagwirizana ndi masensa opangidwa ndi LoRa communication protocol yopangidwa ndikugwiritsidwa ntchito ndi SemTech. Chipangizo chatsopanochi chitha kuphatikizidwa mumagulu olumikizira opanda zingwe a gulu ndi zinthu zina zomwe zimayang'ana maukadaulo olumikizira mphamvu zochepa.

LAYER®Vault7gw

Blecon
Kulumikizana
Blecon: Kuthandizira Kulumikizana kwa Sensor IoT ndi Bluetooth Low Energy ndi Blecon

Blecondp2

Yakhazikitsidwa mu 2021 ndipo likulu lake ku Cambridge, UK, Blecon yakhazikitsa ukadaulo womwe umathana ndi zolepheretsa kufalikira kwa IoT pogwiritsa ntchito BLE.

Ukadaulo wa Bluetooth Low Energy (BLE) ndiukadaulo wofunikira pakulumikiza opanda zingwe pa IoT ndi zida zama sensor. Ngakhale mphamvu zochepa za BLE, magwiridwe antchito ndi kulimba kumapangitsa kukhala chisankho choyenera pakutumiza kwa IoT yamakampani, palinso zovuta zina. Kufunika kolumikiza zida ndi kufunikira kotumiza deta kumtambo kudzera muzokonda kapena zipata ndi zina mwazinthu zingapo zolepheretsa zomwe zimalepheretsa kufalikira kwa protocol yotchuka iyi yopanda zingwe.

Blecon akukhulupirira kuti ndi nthawi yoti makampaniwo ayambe kuganizira za BLE ngati njira yolumikizirana ndi IoT yamtambo m'malo motengera njira yomwe imagwiritsidwa ntchito pamagetsi ogula. Blecon yasintha BLE kukhala njira yolumikizira ya IoT yothandiza komanso yowongoka ndikuyambitsa zinthu ndi mautumiki apaintaneti omwe angagwiritsidwe ntchito kuphatikiza mapangidwe. Kupyolera mu njira yake, Blecon ikufuna kupereka mitundu yotumizira ma Wi-Fi ndi ma netiweki amtundu wa ma cellular potengera mphamvu zotsika mtengo, zotsika mphamvu za BLE.

Kuthandizira Kulumikizana kwa Sensor IoT ndi Bluetooth Low Energyl9u

Zida za Analogi
Edge Technology
Kugwiritsa Ntchito Zowoneka Pogwiritsa Ntchito AI Pamphepete ndi MAX78000 Microcontroller ndi Analog Devices

Analogi Deviceshca
Yakhazikitsidwa mu 1965, Analog Devices (ADI) ndi mtsogoleri wapadziko lonse lapansi mu tchipisi ta analogi, kupanga ADC, DAC, MEMS ndi DSP chips kwa ogula ndi mafakitale.

Chogulitsa chomwe walandira mphothocho chimachokera ku MAX78000 microcontroller's m'mphepete mwa AI visual servo (Visual Servoing Using AI at the Edge with the MAX78000 Microcontroller), ADI AI MCU MAX78000, yomwe ndi chipangizo champhamvu chotsika kwambiri chomangidwa mu hardware CNN, ma microscores apawiri, ma microscores angapo, ma memory. MAX78000 idapangidwa kuti ipereke kuthekera kogwiritsa ntchito ma neural network ndi mphamvu yotsika kwambiri: chowonjezera cha hardware-based convolutional neural network (CNN) accelerator imatha kuchita malingaliro a AI (pogwiritsa ntchito zitsanzo zophunzitsidwa kale) pamilingo yotsika kwambiri.


Mapeto
Sensors Converge 2024 Best of Sensors Awards amawonetsa matekinoloje apamwamba kwambiri padziko lonse lapansi chaka chino, makamaka akuyang'ana paukadaulo wopanga anthu ambiri. Matekinoloje ambiri a sensor ndi otsogola komanso otsogola.

Ndi chitukuko cha Sensor yaku Chinamakampani, makampani ochulukirachulukira akutuluka ku China kukachita nawo mpikisano pamsika wa sensor padziko lonse lapansi. Lumikizanani nafetsopano kuti mudziwe zambiri za sensor.