Litaba tsa indasteri
0102030405
Lethathamo la Likhau tsa 2024 tsa Global Best Sensor
2024-08-09
Hoseng ha la 26 Phuptjane (thapama ea la 25 Phuptjane, nako ea lehae United States), nakong ea Sensors Converge (eo pele e neng e le Sensor Expo), e 'ngoe ea lipontšo tse tharo tse kholo tsa lefats'e tsa sensor, bahlophisi ba Sensors Converge le Fierce El.Ectronics e phatlalalitse lenane la Likhau tse Molemohali tsa 2024 tsa Sensors.
Ketsahalo ea khetho ea Likhau tse Molemohali tsa Sensor e 'nile ea tšoaroa ka lilemo tse 30, e shebane le lihlahisoa tse ntlehali le tse nchafalitsoeng, mahlale, lihlopha le batho ba indasteri ea li-sensor. E ikemiselitse ho lemoha le ho khothaletsa kananelo e atileng ea litheknoloji le lihlopha tsa indasteri tse tlisang phetoho. Bahlōli ba khethoa ke lekhotla la litsebi le ipapisitseng le boleng ba sehlahisoa kapa motho ka mong 'marakeng, mathata ao e a rarollang kapa phello ea mathata ao a a rarollang, le ho ikhetha ha moralo.
Bakhau ba Makhaola-khang a Sehlahisoa sa Selemo se Secha sa 2024:
Thuto ea AI / Mochini
Lam Research Equipment Intelligence® Solutions ka Lam Research
Likoloi/ Tse ikemetseng
Sonair - Sensor e tsoetseng pele ea 3D Ultrasonic bakeng sa Autonomous Robotics ka Sonair
o
Cleantech/Sustainability
LAYER®Vault ka Dracula Technologies
o
Khokahano
Blecon: E nolofalletsa Khokahano ea Sensor IoT le Bluetooth Low Energy ka Blecon
o
Theknoloji ea Edge
Ts'ebeletso ea Pono e Sebelisang AI ho Edge e nang le MAX78000 Microcontroller ka Lisebelisoa tsa Analog
o
Embedded Computing
Snapdragon X Elite Platform ka Qualcomm Technologies, Inc.
o
Indasteri le Tlhahiso
Next Generation High Precision 6DoF Inertial Sensor for Industrial Applications by Murata Electronics
IoT
NOVELDA X7 Ultra-Low Power Presence Sensor ka Novelda AS
MEMS
Sehlopha sa Pele sa Lefatše sa ho Tsamaisa, Multi-Axis, Chip Scale MEMs 3 Axis Accelerometer ka MEI Micro, Inc.
Optical & Imaging
VD55G1 sensor ea khamera ka STMicroelectronics
Matla
EnerCera betri e ka nchafatsoang ke NGK Insulators, LTD.
Tsa Bongaka & Liaparo
ZenVoice Bone: Ultimate Deep Noise Reduction Algorithm bakeng sa TWS Earbuds ka AiZip & Bosch
Likhau tsa Likhau tsa Motho ka Mong tsa 2024 ke:
Phethahatso ea Selemo
Alissa M. Fitzgerald, PhD, Mothehi le CEO, AMFitzgerald
Mosali oa Selemo
Rosa Chow, Motlatsi oa Mopresidente oa Software Engineering, TDK Corporation
Naleli e Phallang
Charlotte Savage-Pollock, Mothehi le CIO, HaiLa Technologies Inc.
Ho qala ha Selemo
Litlhaloso tsa likarolo tsa HaiLa Technologies, Inc.
Khampani ea Selemo
Theknoloji ea Microchip
Kenyelletso ho lik'hamphani le lihlahisoa tsa sensor tse hapileng (Karolo ea 1)
Lam Research
Thuto ea AI / Mochini
Lam Research Equipment Intelligence® Solutions ka Lam Research
Sehlahisoa se hlōlang ke Lam Research Equipment Intelligence® Solutions, e thusang bareki ho potlakisa phetoho ea theknoloji ka theko e tlaase, ka tšebeliso e fokolang ea lisebelisoa, ha ba ntse ba fokotsa litšila. Ho finyella sena, ntle le ho potlakisa R & D ho ntlafatsa ts'ebetso ea lisebelisoa, ho boetse hoa hlokahala ho fumana litsela tsa ho finyella tlhahiso ea boleng bo phahameng (HVM) ka theko e tlaase. Equipment Intelligence® e na le li-module tsa litšiea tse 'nè - marang-rang a digital / digital, nts'etsopele ea ts'ebetso ea sebele, lisebelisoa tse bohlale le lits'ebeletso tsa digital - tse ka kopanyang mohlala oa data, virtualization le bohlale ba maiketsetso (AI) likarolong tsohle tsa ho qapa, ho nts'etsapele, ho reka, ho haha le ho tšehetsa litsamaiso le lits'ebetso, ho tloha mohopolong ho ea ho thuto ea ho khoneha ho ea ho HVM.
Mohloli:https://www.lamresearch.com/
Sonair
Likoloi/ Tse ikemetseng
Sonair - Sensor e tsoetseng pele ea 3D Ultrasonic bakeng sa Autonomous Robotics ka Sonair
E thehiloe ka 2022, Sonair e sebetsa ka ho khetheha ho li-sensor tsa ultrasonic tse fokotsang moroalo oa lichelete o amanang le likoloi tse tsamaisoang ka boiketsetso (AGVs) le liroboto tsa mobile tse ikemetseng (AMRs). Khamphani e bolela hore ka ho sebelisa theknoloji e nang le tokelo ea molao e ntlafalitsoeng ho SINTEF MiNaLab ea Europe, li-sensor tsa eona li ka ntlafatsa pono ea roboto ho tloha 2D ho ea ho 3D, ntlafatso e kholo ho feta lits'ebetso tsa setso tsa lidar le likhamera.
Mokhoa oa ho nka khau oa sensor e ncha ea 3D e hapileng moputso ke theknoloji ea beamforming, e leng motheo oa sonar le radar hammoho le ts'ebetso ea litšoantšo tsa ultrasound tsa bongaka. Sonair e kopanya wavelength-matched ultrasonic Transducers e nang le software ea sejoale-joale bakeng sa ho etsa beamforming le mekhoa ea temoho ea ntho ho fumana lintlha tse tharo tsa sebaka ka theko e tlase. Sonair e hlalosa mochine o mocha oa 3D ultrasonic sensor e le mokhoa o mong oa li-sensor tsa lidar (LiDAR) tse theko e boima, 'me k'hamphani e lebeletse hore 3D ultrasonic sensor e tla rekisoa ka 50% ho ea ho 80% ea litšenyehelo tsa lisebelisoa tsa lidar.
Mohloli:https://www.sonair.com/company
Dracula Technologies
Cleantech/Sustainability
LAYER®Vault ka Dracula Technologies
Dracula Technologies ke qalo ea Mafora e thehiloeng ka 2011 ka mor'a morero oa mokhatlo oa lipatlisiso oa sechaba CEA (Commissariat à l'énergie atomique et aux énergies alternatives, kapa French Alternative Energies and Atomic Energy Commission). CEO Brice Cruchon o bone bokhoni ba khoebo ea thekenoloji, 'me ka mor'a lilemo tse tšeletseng tsa lipatlisiso le nts'etsopele, LAYER e ile ea qala ts'ebetso e tebileng ea theknoloji ka lenaneo la "Hello Hosasa".
Sehlahisoa se hapileng khau LAYER® Vault , Dracula e sebelisa theknoloji ea organic photovoltaic (OPV, kapa organic solar cell) e fumanehang hangata ho liprinta tsa inkjet ho hlahisa. phepelo ea motlakase thekenoloji. Li-module tsa OPV, tse bitsoang LAYER (kapa Leseli E le Karabelo ea Hao e Matla), li sebetsa ka tlung ka leseli la tlhaho kapa la maiketsetso, 'me li ka sebelisoa ho matlafatsa lisebelisoa tsa ka tlung tse sa sebelisoeng haholo. Hobane li hatisitsoe, ho e-na le ho etsoa ka silicon, sebōpeho sa li-module tsa OPV se etsoa habonolo haholoanyane, 'me ho fapana le libeteri tse ngata, ha e sebelise lefatše le sa tloaelehang kapa lirafshoa tse boima. Ho e-na le hoo, li-modules li entsoe ka thepa e entsoeng ka carbon.
Dracula Technologies e kene tšebelisanong le motseteli oa eona SemTech, e fanang ka li-semiconductors, litsamaiso tsa IoT le lits'ebeletso tsa khokahano ea leru. Sesebelisoa sa LayerVault se lumellana le li-sensor tse thehiloeng ho protocol ea puisano ea LoRa e entsoeng le e sebelisoang ke SemTech. Sesebelisoa se secha se ka kopanngoa le li-chips tsa khokahanyo tse se nang mohala tsa sehlopha le lihlahisoa tse ling tse shebaneng le theknoloji ea khokahanyo ea matla a tlase.
Blecon
Khokahano
Blecon: E nolofalletsa Khokahano ea Sensor IoT le Bluetooth Low Energy ka Blecon
E thehiloe ka 2021 'me e le ntlo-kholo ea Cambridge, UK, Blecon e phatlalalitse theknoloji e hlolang litšitiso tsa phepelo e atileng ea IoT e sebelisang BLE.
Theknoloji ea Bluetooth Low Energy (BLE) ke theknoloji ea bohlokoa bakeng sa khokahanyo ea mohala ea IoT le lisebelisoa tsa sensor. Leha thepa ea matla a tlase ea BLE, ts'ebetso le ho tiea li e etsa khetho e nepahetseng bakeng sa phepelo ea IoT ea indasteri, ho boetse ho na le mathata. Tlhokahalo ea ho para sesebediswa le tlhokahalo ea ho fetisetsa data ho leru ka lits'ebetso tsa tloaelo kapa menyako ke tse ling tsa lintlha tse fokotsang tse sitisang ho amoheloa ha protocol ena e tsebahalang e se nang mohala.
Blecon e lumela hore ke nako ea hore indasteri e qale ho nka BLE e le protocol ea khokahano ea IoT ea leru ho fapana le mokhoa oa ntlha-to-point o sebelisoang ho lisebelisoa tsa elektronike tsa bareki. Blecon e ntlafalitse BLE ho ba mokhoa o sebetsang le o otlolohileng oa khokahanyo ea IoT mme e tsebahalitse lihlahisoa le lits'ebeletso tsa marang-rang tse ka sebelisoang ho kopanya moralo. Ka katamelo ea eona, Blecon e ikemiselitse ho fana ka mefuta ea phepelo bakeng sa mefuta ea marang-rang ea Wi-Fi le ea cellular ho ipapisitse le matla a theko e tlase, a matla a tlase a BLE.
Mohloli:https://www.blecon.net/
Lisebelisoa tsa Analog
Theknoloji ea Edge
Ts'ebeletso ea Pono e Sebelisang AI ho Edge e nang le MAX78000 Microcontroller ka Lisebelisoa tsa Analog
E Thehiloe ka 1965, Analog Devices (ADI) ke moetapele oa lefats'e oa li-analog chips, ho etsa lihlahisoa tsa ADC, DAC, MEMS le DSP bakeng sa lihlahisoa tsa bareki le tsa indasteri.
Sehlahisoa se hapileng moputso se ipapisitse le MAX78000 microcontroller's AI visual servo (Visual Servoing Using AI at the Edge with the MAX78000 Microcontroller), ADI AI MCU MAX78000, e leng chip ea matla a tlase haholo e hahiloeng ka har'a Hardware CNN, li-micro-cores tse peli, memori e mengata, memori e mengata. MAX78000 e etselitsoe ho fana ka bokhoni ba ho phethahatsa marang-rang a neural a nang le matla a tlase haholo: sekontiri se kopantsoeng sa hardware-based convolutional neural network (CNN) se ka etsa mabaka a AI (ho sebelisa mehlala e koetlisitsoeng pele) maemong a tlase haholo a matla.
Qetello
Sensors Converge 2024 Best of Sensors Awards e bonts'a mahlale a morao-rao a morao-rao a lefats'e selemong sena, a shebane haholo le mahlale a tlhahiso ea bongata. Litheknoloji tse ngata tsa sensor li potlakile ebile lia etella pele.
Ka tsoelopele ea Sensor ea Chinaindasteri, lik'hamphani tse ntseng li eketseha li tsoa Chaena ho ea nka karolo tlholisanong ea 'maraka oa li-sensor tsa lefats'e. Iteanye le ronajoale ho fumana lintlha tse qaqileng tsa sensor.