Ho kopanya mohala ke eng?
Selelekela sa motheo ho Khokahano ea Mohala
Khokahano ea mohala ke ts'ebetso ea bohlokoa ts'ebetsong ea ho paka semiconductor. E sebelisa mocheso, khatello le matla a ultrasonic ho cheselletsa lithapo tsa tšepe ka thata ho kenya li-pads lisebelisoa tsa ho kopanya, ka hona ho fihlela elEctkhokahano ea rical lipakeng tsa li-chips le substrates, le phapanyetsano ea tlhahisoleseling lipakeng tsa lichifi.
INmekhoa ea ho kopanya
Ultrasonic bonding:
Sebelisa jenereithara ea ultrasonic (60 ~ 120KHz) ho etsa hore sesebelisoa sa bonding se thothomele se otlolohile 'me se sebelise khatello ea tlase ka nako e le 'ngoe. Tlas'a ketso ea matla ana a mabeli, sesebelisoa sa tlamahano se khanna etella pele ho itlotsa ka potlako holim'a tšepe holim'a sebaka sa tjheseletsa, 'me moeta-pele o kena deformation ea polasetiki tlas'a ketso ea matla,' me e amana haufi-ufi le sebaka sa ho tlama ka hare ho 25ms ho theha weld. Hangata e sebelisetsoa ho kopanya lithapo tsa aluminium. Lipheletso ka bobeli tsa ntlha ea bonding li bōpehile ka mokhoa oa chedge.
Thermocompression bonding:
Sebelisa khatello le ho futhumatsa ho etsa hore liathomo tse holim'a ho kopana ha terata ea tšepe le sebaka sa ho tjheseletsa se fihlelle moeling oa khoheli ea athomo, ka hona ho fihlela sepheo sa ho kopanya. Thempereichara ea substrate le chip e fihla ho 150 ° C. E atisa ho sebelisoa bakeng sa ho kopanya lithapo tsa khauta, ntlha e 'ngoe e chitja' me e 'ngoe e bōpehile ka chesele.
Thermosonic bonding:
E sebelisetsoa ho kopanya lithapo tsa Au le Cu. E boetse e sebelisa matla a ultrasonic, empa phapang e tsoang ho ultrasound ke hore mohloli oa mocheso o ka ntle o tlameha ho fanoa nakong ea ho tlamahane, 'me mohala o tlamang ha o hloke ho senyeha ho tlosa bokaholimo ba oxide. Sepheo sa mocheso o ka ntle ke ho kenya tšebetsong boemo ba matla ba thepa, ho khothaletsa khokahanyo e sebetsang ea litšepe tse peli le ho hasana le ho hola ha metsoako ea intermetallic.
Mefuta ea li-wire bonding e arotsoe katlamahano ea bolo le khokahanyo ea li-wedge
Melemo ea ho kopanya bolo:
E sebetsa ho micro-package: Ball bonding e loketse micro-package le chip-level sephutheloana, 'me e ka finyella welding e nyenyane haholo.
Tšebeliso e tlase ea matla: Nakong ea ts'ebetso ea ho cheselletsa bolo, matla a fokolang a fetisoa, kahoo tšebeliso ea matla e batla e le tlase.
E sebetsa ho tjheseletsa ea terata ea khauta: Ho kopanya bolo hangata ho sebelisa terata ea khauta bakeng sa welding, 'me terata ea khauta e na le conductivity e ntle le ts'epahalo.
Mathata a ho kopanya bolo:
Litšenyehelo tse phahameng: Thepa ea ho kopanya bolo le litšenyehelo tsa thepa li holimo, kahoo litšenyehelo tse amanang li phahame.
Lithibelo tse ling: Khokahano ea bolo e na le lithibelo tse itseng ho lisebelisoa le meaho ea li-chips le li-packaging substrates, 'me ha e tšoanelehe bakeng sa mefuta eohle ea liphutheloana.
Lintlha tsa pele le tsa bobeli tsa tlamahano ea bolo:
Melemo ea ho kopanya wedge:
E sebetsa ho lisebelisoa tsa motlakase: Wedge bonding e loketse lisebelisoa tsa motlakase le liphutheloana tse ling tse khethehileng, 'me e ka mamella maqhubu a maholo le matla.
Litšenyehelo tse tlase: Ha li bapisoa le bolo, theko ea thepa le thepa e tlase e tlase.
Mefuta e mengata ea ts'ebeliso: Khokahano ea Wedge e na le litlhoko tse batlang li hlephileng holim'a thepa le meaho ea li-chips le likaroloana tsa liphutheloana, 'me e na le mefuta e mengata ea lits'ebetso.
Mathata a ho kopanya wedge:
Tekanyetso ea boholo: Bonding ba wedge hangata ha bo khone ho kenya liphutheloana tse nyane, 'me ho na le lithibelo tse itseng mabapi le boholo ba welding.
Tšebeliso e phahameng ea matla: Wedge bonding e fetisetsa matla a mangata nakong ea ts'ebetso ea welding, kahoo tšebeliso ea matla e batla e phahame.
Lintlha tsa pele le tsa bobeli tsa bonding tsa wedge bonding:
Kopo ea ho kopanya mohala
Theknoloji ea ho kopanya mohala e sebelisoa haholo indastering ea tlhahiso ea lisebelisoa tsa elektroniki, haholo ts'ebetsong ea ho paka lipotoloho tse kopaneng, li-sensor, li-microprocessors le lisebelisoa tse ling tsa elektroniki. Tse latelang ke tse ling tsa ts'ebeliso ea mantlha ea thekenoloji ea li-wire bonding:
Sephutheloana sa potoloho e kopaneng (IC): Khokahano ea mohala ke e 'ngoe ea lits'ebetso tsa bohlokoa tsa ho paka ka potoloho e kopaneng. E sebelisetsoa ho hokahanya lithakhisa ho chip le li-lead ho substrate ea ho paka ho hlokomela kamano pakeng tsa chip le potoloho ea kantle. Mokhoa ona oa ho paka o ka finyella litlhoko tsa boholo bo nyane le ts'ebetso e tsitsitseng, kahoo e sebelisoa haholo mefuteng e sa tšoaneng ea lipotoloho tse kopantsoeng.
Ho etsa li-sensor: Li-sensor tse ngata, joalo ka li-sensor tsa khatello, li-sensor tsa mocheso, li-optical sensors, joalo-joalo, li hloka theknoloji ea ho kopanya mohala ho hokahanya chip le substrate ea liphutheloana ho hlokomela ho fumana le phetiso ea matšoao. Khokahano ea mohala e ka netefatsa botsitso le kutlo ea kutlo, ka hona e sebelisoa haholo tlhahisong ea li-sensor.
Sephutheloana sa Microprocessor: Microprocessor ke karolo ea mantlha ea sesebelisoa sa elektroniki. Theknoloji ea khokahanyo ea mohala e sebelisoa ho hokahanya chip ea microprocessor le substrate ea ho paka ho hlokomela ts'ebetso le taolo ea matšoao. Khokahano ea mohala e ka netefatsa botsitso le ts'epahalo ea microprocessor, ka hona e sebelisoa haholo ka har'a liphutheloana tsa microprocessor.
Sephutheloana sa LED: Ka tlhahiso ea LED (light-emitting diode), theknoloji ea ho kopanya mohala e sebelisoa ho hokahanya li-chips tsa LED ho substrate ea ho paka ho fihlela tlhahiso ea hajoale le tlhahiso ea lets'oao la leseli. Khokahano ea mohala e ka netefatsa khanya le botsitso ba li-LED, ka hona e sebelisoa haholo ka har'a liphutheloana tsa LED.
Lipotoloho tse Kopanetsoeng tsa Hybrid: Li-circuits tse kopaneng tsa Hybrid hangata li entsoe ka mefuta e mengata e fapaneng ea lisebelisoa. Theknoloji ea li-wire bonding e sebelisoa ho hokahanya lisebelisoa tsena hammoho ho finyella ts'ebetso ea ts'ebetso le mosebetsi oa tšebelisano. Ho kopanya ka terata ho phetha karolo ea bohlokoa tlhahisong ea potoloho e nyalisitsoeng.
Ka kakaretso, theknoloji ea ho kopanya mehala e na le lits'ebetso tsa bohlokoa ts'ebetsong ea ho paka lisebelisoa tse fapaneng tsa microelectronic. E ka netefatsa botsitso, ts'epahalo le ts'ebetso ea lisebelisoa le ho khothaletsa nts'etsopele le ts'ebeliso ea lisebelisoa tsa microelectronic.
Kea leboha ha u ntse u bala. Haeba u batla ho tseba haholoanyane ka teratalisebelisoa tsa ho kopanya, Ka kopo iteanye le ronahang-hang!