Semiconductor Packaging Process Bonding Wedge

Tlhaloso

The splitter, eo hape e tsejoang e le nozzle ea tšepe le nale e emeng, ke karolo ea bohlokoa ea tlamahano ea loto ts'ebetsong ea semiconductor ea ho paka, eo ka kakaretso e kenyelletsang ho hloekisa, sesebelisoa sa chip sintering, lead bonding, cap e tiisang le lits'ebetso tse ling. Lead bonding ke theknoloji ea ho lemoha khokahano ea motlakase le khokahanyo ea tlhahisoleseling lipakeng tsa chip le substrate. Sekhahla se kentsoe mochining oa ho kopanya o etellang pele. Tlas'a ts'ebetso ea matla a kantle (ultrasonic, khatello, mocheso), ka deformation ea polasetiki ea tšepe le phallo e tiileng ea liathomo, terata e etellang pele (terata ea khauta, khoele ea khauta, terata ea aluminium, mohala oa aluminium, mohala oa koporo, khoele ea koporo) le terata ea bonding e thehoa. Ho fihlella khokahano lipakeng tsa chip le potoloho.