Thermal and absorbing

Thermal Interface

Description

The function of thermal interface materials is to fill the air gap between heating elements and heat dissipation elements, improving heat dissipation efficiency. When thermal interface materials are not used, a portion of the effective contact area between the heating element and the heat dissipation element is separated by air, which is a poor conductor of heat and cannot effectively conduct heat. After using thermal conductive interface materials, the air gap is filled to achieve effective heat transfer, which can greatly reduce the interface thermal resistance, fully utilize the function of the heat sink, reduce the temperature of the heat source, and thus improve the working stability and service life of electronic products. Thermal interface materials are divided into pad and adhesive types.

product details

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Thermal interface material - pad type

Flexible thermal pad

Flexible thermal pads are made of a silicone or non-silicone resin matrix filled with thermally conductive fillers. These pads possess a certain degree of flexibility, compressibility, and a natural surface stickiness. They can fill gaps and dissipate heat while also providing shock absorption and insulation, meeting the design requirements for miniaturization and ultra-thin devices. Thermal gap pads are available in a wide range of thicknesses and are widely used in electronic components, serving as an excellent thermal filler. Currently, the company can produce standard-sized sheets with thermal conductivities ranging from 1W/mK to 12W/mK, and can also be cut into custom shapes for ease of use. Thermal conductive pads are naturally sticky on both sides, and single-sided adhesive versions are also available for easy installation and use. Furthermore, thermal compound pads can be fiberglass reinforced to enhance their physical properties for even more demanding environments.

Thermal Pad Features

● Wide range of thermal conductivity, covering 1W/mK to 12W/mK

● Depending on the product, you can choose double-sided adhesive, single-sided adhesive, or non-adhesive

● All series of products comply with RoHs standards

● Glass fiber reinforcement is available

● Can be cut into specified shapes and color is adjustable

Thermal Pad Typical Applications

Circuit boards, communication equipment, and optoelectronics industries.

Thermal Pad Model

DSGP-100-203406-10

Part 1: DSGP stands for Flexible Thermally Conductive Pad;

Part 2: 100 means the thermal conductivity of the product is 1W/mK;

Part 3: represents length*width; such as 203406 width 203mm*length 406mm;

Part 4: represents the thickness, such as 10 represents 1.0mm thick.

For glass fiber reinforcement, please add -F to the end of the product model, such as GP100-203406-10-F.

If single-sided adhesive is required, please add -S at the end, such as GP100-203406-10-S.

Note: The standard size of 1W/mK~12W/mK products is 203mm*406mm.

DSGP-150 Product Specifications

Project Name	model	Physical properties			Thermal conductivity
		Density (g/cc)	Thickness (mm)	Hardness (share00)	Thermal conductivity (W/m*k, ±0.2)	Working temperature (℃)
parameter	DSGP-150	2.5	0.25～5	40	1.5	-55～+200
Test Method	\	ASTM D792	ASTM D374	ASTM D2240	ASTM D5470	\
Project Name	Electrical properties			reliability
	Breakdown voltage (KV/mm)	Volume resistivity (Ω*cm)	Dielectric constant (@1MHz,min)	Flame retardant grade	Shelf life	other
parameter	≥6	10¹³	5.8	VO	December	RoHS compliant
Test Method	ASTM D149	ASTM D257	ASTM D150	UL-94	\	\

How to use

1. Clean the surface of the device or radiator with alcohol, and then place a new heat sink pad as required.

2. Peel off the release films on the upper and lower layers of the flexible thermal relief pad, and place the flexible thermal relief pad on the device or radiator to be used.

3. The viscosity of the material can ensure contact with the interface without additional pressure. Because additional pressure may cause changes in the thickness and surface flatness of the heat sink pad, which may lead to poor contact with the interface.

4. Flexible thermal pads cannot be reused because the change in thickness may not ensure good interface contact.

5. The compression ratio is recommended to be 20-30%. This can ensure good contact between the cooling thermal pad and the two interfaces while avoiding greater pressure on the device. If you need to compress the product by more than 50% to cope with some specific usage environments, please contact the company.

Thermally conductive insulator

Thermally conductive insulation sheet, also known as thermally conductive silicone cloth, is a silicone polymer elastomer reinforced with glass fiber as the base material. This product can effectively reduce the thermal resistance between electronic components and radiators, and has electrical insulation, high breakdown voltage strength, good thermal conductivity, tear resistance and other characteristics, which can effectively avoid accidents such as leakage and breakdown. At the same time, the thermally conductive insulation sheet has strong temperature resistance, avoiding aging and deterioration due to long-term overheating.

The company can produce and process plates of standard sizes, and can also cut them into specified shapes according to customer needs for easy use by customers.

Thermally conductive insulator

Performance characteristics

● Low thermal resistance

● High insulation performance

● High strength, easy to process into specified shapes

●Can be coated with thermal conductive adhesive on one side

Application Areas

Power supplies, power semiconductors, motor controllers, etc.

Product Model

DSGPF-1500-150150-10

Part 1: DSGPF stands for Thermally Conductive Insulating Pad;

Part 2: represents the thermal conductivity of the gasket. For example, 1500 represents 15W/mK;

Part 3: represents length*width, such as 150150, length 150mm*width 150mm;

Part 4: represents the thickness, such as 10 represents 1.0mm thick.

DSGPF-900

Project Name	Product Model	Physical properties
		color	Density(g/cc)	Thickness(mm)	Hardness (share00)	Width(mm)
parameter	DSGPF-900	grey	2.0	0.18/0.23	85	305
Test Method	\	Visual inspection	ASTM D792	ASTM D374	ASTM D2240	\
Project Name			Thermal conductivity			Electrical properties
	Breaking strength (lbs/in)	composition	Thermal conductivity (W/mK)	Thermal resistance (℃, in2/W)	Working temperature (℃)	Breakdown voltage (KV)
parameter	100	Glass fiber, silicone resin	0.9	0.45	-55～180	3.5@0.18mm 4.5@0.23mm
Test Method	ASTM D1548	\	ASTM D5470	ASTM D5470	\	ASTM D149
Project Name	Electrical properties		reliability
	Volume resistivity (Q*cm)	Dielectric constant (@1MHz,min)	Flame retardant grade	Shelf life	other
parameter	10	5.5	VO	24 months	RoHS compliant
Test Method	ASTM D257	ASTM D150	UL-94	\	\

How to use

1. Clean the surface of the device or radiator that needs to be used.

2. Place the insulation sheet at the location to be used and fix the thermal conductive sheet with the equipment. Be careful to avoid wrinkles or bubbles to avoid poor contact.

Phase change thermal pad

Thermally conductive phase change materials can maximize the heat dissipation performance of the radiator. At room temperature, the material is in solid form and easy to handle. When the temperature is higher than the phase change temperature of the material, the material begins to soften and becomes viscous and fluid, fully filling the microscopic irregular gaps at the contact interface of electronic components, thereby minimizing the material filling thickness and interface contact thermal resistance. In addition, this phase change characteristic avoids contamination during the installation process and improves product reliability.

Phase change thermal pad

Performance characteristics

Ultra-low thermal resistance

Thermal conductivity 3~6W optional

Natural adhesive, no adhesive required

Application Areas

Computers, communication equipment, LEDs, etc.

Product Model

DSGPX-400-1000

Part 1: DSGPX stands for thermally conductive phase change material;

The second part: represents the thermal conductivity of the material. For example, 400 represents 4W/m*K;

The third part represents the packaging size. For example, 1000 represents 1 kg. The standard size is 1 kg, and customization is supported.

DSGPX-400 Product Specifications

Project Name	Product Model	Physical properties			Thermal conductivity
		Density (g/cm³)	Thickness (mm)	Volume resistivity (Ω*cm)	Phase transition temperature (℃)
parameter	DSGPX-400	2.60	0.25～1.00	10¹ ⁰	50
Test Method	\	ASTM D792	\	ASTM D257	ASTM D5470
Project Name	Thermal conductivity			reliability
	Thermal conductivity (W/m*k)	Thermal resistance (in2℃/W,@80℃ 40psi)	Operating temperature	Flame retardant grade	Shelf life
parameter	4.0	0.008	-55～100	VO	12 months
Test Method	ASTM D5470	ASTM D5470	\	UL-94	\

DSGPX-600 Product Specifications

Project Name	Product Model	Physical properties			Thermal conductivity
		Density (g/cm³)	Thickness (mm)	Volume resistivity (Ω*cm)	Phase transition temperature (℃)
parameter	DSGPX-600	2.60	0.25～1.00	10¹ ⁰	50
Test Method	\	ASTM D792	\	ASTM D257	ASTM D5470
Project Name	Thermal conductivity			reliability
	Thermal conductivity (W/m*k)	Thermal resistance (in2℃/W,@80℃ 40psi)	Operating temperature	Flame retardant grade	Shelf life
parameter	6.0	0.005	-55～100	VO	12 months
Test Method	ASTM D5470	ASTM D5470	\	UL-94	\

How to use

1. Wipe the surface to be coated with an alcohol cloth until there is no impurity;

2. Remove the thermal conductive phase change material from the base film and stick it on the surface of the radiator. If there are slight bubbles during the bonding process, there is no need to re-stick the material.

After the material melts, the air will be expelled. After bonding, press the material gently with your thumb to ensure a good bond. Note: The product has natural stickiness and does not require

The radiator surface can be directly pasted after being processed. If the construction environment temperature is lower than 20℃, the surface viscosity of the material will decrease.

You can heat the surface with a hot air gun and then paste it.

3. After applying, grab the handle on the surface of the material and remove the protective film from the surface of the material. It will be easier to tear it off from a corner.

Thermal interface material - adhesive type Thermal adhesive

One-component thermal adhesive glue

Single-component thermal conductive adhesive is a single-component thermal conductive material with a better stress-strain value than thermal conductive silicone gaskets. It meets the thermal conductivity requirements in narrow spaces and low-stress scenarios and is the best choice for heat dissipation products when multiple chips share a heat sink or structural parts. Single-component thermal conductive glue has good fluidity and can be automated using dispensing equipment.

One-component thermal adhesive glue

Application Areas

Processors, semiconductor blocks and heat sinks, base station antenna devices, etc.

Thermal adhesive glue Model

DSGPS-200-150

Part 1: DSGPS stands for single-component thermally adhesive glue;

Part 2: 200 represents the thermal conductivity of the glue, such as 200 represents 2W/m*k;

Part 3: represents the packaging specifications. For example, 150 represents 150g/specification. Standard specifications include 150g/500g/900g, etc. Customized packaging can be developed according to the client's dispensing equipment.

DSGPS-200 Product Specifications

Project Name	model	Physical properties			Thermal conductivity
		Density (g/cc)	Minimum filling gap (mm)	Extrusion rate (g/min, min)	Thermal conductivity (W/m*k, ±0.2)	Working temperature (℃)
parameter	DSGPS-200	2.3	0.1	25	2.0	-50～+200
Test Method	\	ASTM D792	\	Φ2.0mm needle @90Psi	ASTM D5470	\
Project Name	Electrical properties		reliability
	Breakdown voltage (KV/mm)	Volume resistivity (Ω*cm)	Flame retardant grade	Shelf life	other
parameter	≥5	≥10¹³	VO	December	RoHS compliant
Test Method	ASTM D149	ASTM D257	UL-94	\	\

Instructions

① Dispensing. The syringe packaging of the single-component thermal adhesive can be directly connected to the standard dispensing equipment for dispensing.

② Manual scraping. In some occasions where it is inconvenient to use dispensing equipment, the thermal adhesive can also be scraped on the surface of the device or radiator where it is needed according to the designed tooling.

Two-component thermal adhesive glue

Two-component thermally conductive gel is a thermally conductive gel product that can be cured at room temperature. It is mixed in a static mixer and applied to the surface of the device to be cooled. It can be cured at room temperature. After curing, it forms a flexible thermally conductive elastomer that has good contact with the surface of the device to be cooled, thus improving the thermal conductivity efficiency.

In addition, the thermally conductive elastomer formed after curing can eliminate the stress caused by the alternating hot and cold environment, and has a shock-absorbing function, which improves the overall reliability of the equipment. It is suitable for large gaps where multiple components share a heat sink. After the two-component thermal adhesive glue is mixed in a 1:1 ratio, it can be automated using dispensing equipment.

Two-component thermal adhesive glue

Application Areas

High-performance CPUs, semiconductors, radiators, etc.

Thermal adhesive glue Model

DSGPD-100-400

Part 1: DSGPD stands for two-component thermal adhesive glue;

Part 2: represents the thermal conductivity of the gel. For example, 100 represents 1W/m*k

Part 3: represents the packaging specifications. For example, 400 represents 400g. The standard specifications are 150g/400g. Customized packaging can be developed according to the client's dispensing equipment.

DSGPD-100 Product Specifications

Project Name	model	Physical properties				Electrical properties
		A component color	Color of component B	Extrusion rate (g/min, min)	Hardness (Shore00)	Breakdown voltage (KV/mm)
parameter	DSGPD-100	White	White	200	78	≥20
Test Method	\	Visual inspection	Visual inspection	Φ2.0mm needle @50Psi	ASTM D 2240	ASTM D149
Project Name	Curing conditions			Thermal conductivity
	Surface curing @25℃,min	Fully cured @25℃,h	Accelerated curing @100℃,min	Thermal conductivity (W/m*k)		Working temperature after vulcanization (℃)
parameter	\	48h	\	1		-70～200
Test Method	\	\	\	ASTM D5470		\

Instructions

① Dispensing. The amount of two-component thermally conductive adhesive used can be calculated based on the designed gap and area, and then the amount of dispensing can be controlled by setting the parameters of the dispensing machine. During the dispensing process, the static mixer at the front end of the syringe can achieve a uniform mixing state. The two-color design of the material can also more intuitively observe whether the two components are fully mixed, so as to ensure that the vulcanized product achieves the designed performance.

② Manual scraping. In some occasions where it is inconvenient to use dispensing equipment, the thermal conductive adhesive can also be scraped on the surface of the device or radiator where it is needed according to the designed tooling.

Thermal paste

Thermal grease has high thermal conductivity, low thermal resistance, low viscosity and good electrical insulation properties, and is used in high-power devices such as CPUS, GPUS, ASICS, north bridges and heating devices. Its excellent surface wetting performance allows it to be applied thinly on the surface of heating devices or heat dissipation devices by screen printing, forming good wetting on both sides and reducing the thermal resistance of the system. In addition, the company has also developed silicone-free thermal grease to cope with fields such as communications and displays that are sensitive to silicon.

Thermal paste

Performance characteristics

● Wide range of thermal conductivity and more optional products

● Provide a variety of choices of conventional thermal paste and silicone-free thermal paste

● Good liquidity

Application Areas

Processors, communication equipment, LEDs, etc.

Thermal paste Model

DSGPZ-400-200

Part 1: DSGPZ stands for thermal compound paste;

Part 2: represents the thermal conductivity of the thermal compound paste. For example, 400 represents 4W/m*k;

Part 3: represents the packaging specifications. For example, 200 represents 200g. The standard specifications are 200g, 500g, 1kg, and 2kg. Customization is supported.

Thermal paste Description

① Thermal paste can be effectively filled on the interface between the heating device and the radiator, forming an extremely low interface thickness, the thinnest of which can be less than 20 microns. With the extremely low thickness and high thermal conductivity, thermal paste can provide extremely high heat dissipation efficiency and has a high cost performance.

② Thermal paste will not solidify within the operating temperature range and cannot form a certain thickness. It must be used in an environment without a designed gap and can only be used to compensate for surface roughness and tolerances.

③ Thermal paste itself has a certain degree of electrical insulation, so if the overflowed thermal paste accidentally flows to other locations on the circuit board, it will not cause a short circuit. However, because there is no gap in the structural design, after the heating device and the heat sink are tightly fastened, due to the surface roughness, the device and the heat sink will be directly connected in some areas. Therefore, thermal paste cannot be used as a guarantee of electrical insulation in design. If electrical insulation is required, other thermal interface materials such as flexible thermal pads or thermal insulation sheets are generally selected.

DSGPZ-400 Product Specifications

Project Name	Product Model	Physical properties
		color	Substrate	Density (g/cc)	Viscosity(cps)
parameter	DSGPZ-400	grey	Silicon	2.73	<150000
Test Method	\	Visual inspection	\	ASTM D792	Brookfield Viscometer
Project Name	Thermal conductivity			reliability
	Thermal conductivity (W/m*k)	Thermal resistance (in2℃/W,@50psi)	Working temperature (℃)	Flame retardant grade	Shelf life
parameter	3.8	0.020	-40～150	VO	6 months
Test Method	ASTM D5470	ASTM D5470	\	UL-94	\

How to use

1. Thermal grease needs to be fully stirred for about 3 minutes before use to remix the materials.

2. Use an alcohol cloth to wipe the surface to be coated clean until there is no impurity.

3. Evenly cover the thermal grease on the surface of the device or radiator by screen printing or dispensing. The coating process must be uniform to avoid the generation of bubbles.

4. The mesh count of screen printing can directly control the thickness after coating, and different screen mesh counts can be selected according to design requirements.

5. Avoid applying too much thermal grease to prevent excess material from overflowing after snapping together, causing waste and contamination to other parts.

Thermal Interface

Thermal interface material - pad type

Thermal Pad Features

How to use

Thermally conductive insulator

Performance characteristics

How to use

Phase change thermal pad

Performance characteristics

How to use

Thermal interface material - adhesive type Thermal adhesive

Application Areas

Instructions

Two-component thermal adhesive glue

Application Areas

Instructions

Thermal paste

Performance characteristics

How to use

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