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Semiconductor Packaging Process Bonding Wedge

Bonding Wedge

Semiconductor Packaging Process Bonding Wedge

Description

The splitter, also known as the steel nozzle and the vertical needle, is an important component of lead bonding in the semiconductor packaging process, which generally includes cleaning, device chip sintering, lead bonding, sealing cap and other processes. Lead bonding is a technology to realize the electrical interconnection and information intercommunication between the chip and the substrate. The splinter is installed on the lead bonding machine. Under the action of external energy (ultrasonic, pressure, heat), through the plastic deformation of metal and the solid phase diffusion of atoms, the lead wire (gold wire, gold strip, aluminum wire, aluminum strip, copper wire, copper strip) and the bonding pad are formed. To achieve the interconnection between the chip and the circuit.

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    Type

    Lead bonding is one of the processes in the semiconductor integrated circuit packaging industry, according to different requirements of welding methods, divided into ball bonding and wedge bonding, wedge bonding has a small space operation ability, reduce the signal distortion between the high frequency so that the signal consistency is better, while suitable for high-power product welding the required welding tool is called wedge welding knife. Wedge welding knife is divided into gold wire wedge welding knife, gold belt wedge welding knife, aluminum wire wedge welding knife.

    Applications

    1. In the civil field, lead bonding is mainly used in chip, memory, flash memory, sensor, consumer electronics, automotive electronics, power devices and other industries.
    2. In the military field, lead bonding is mainly used in RF chips, filters, missile seeker, weapons and equipment, electronic information countermeasures system, spaceborne phased array radar T/R components, military electronics, aerospace, aviation and communications industries.

    Material selection

    1.Alloy steel T: Suitable for bonding with some deviations or hard substrates.
    2.Titanium carbide material M: high hardness, strong work conduction, low pressure (it is recommended to start from 7g to increase).
    3.Tungsten steel H:: high hardness, strong work conduction, adjusting parameters close to the United States dewey1.

    WEDGE groove

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    WEDGE Arbor structure

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    WEDGES series

    SMALL WIRE WEDGES

    It is suitable for bonding gold wire, aluminum wire and other wires within 75um.
    WEDGES size table

    TS

    H aperture

    B-L Bonding length

    T Length of tool head

    W Tool head width

    Wiredia.Wire diameter

    unit

    um

    um

    um

    um

    um

    1210

    30

    25

    300

    64

    10-15um

    1510

    38

    25

    343

    64

     

    13-18um

    1515

    38

    38

    356

    64

    1520

    38

    51

    368

    64

    2015

    51

    38

    368

    102

     

    18-25um

    2020

    51

    51

    368

    102

    2025

    51

    64

    381

    102

    2525

    64

    64

    406

    102

    33um

    3025

    76

    64

    432

    127

    38um

    3050

    76

    127

    559

    152

    51um

    3550

    89

    127

    559

    152

    If other specifications are required. Can consult our sales

    LARGE  WIRE  WEDGES

    It is suitable for bonding aluminum wire and other wires above 75um.

    WEDGES size table

    TS

    H aperture

    B-L Bonding length

    T Length of tool head

    W Tool head width

    Wiredia.Wire diameter

    unit

    um

    um

    um

    um

    um

    4560

    114

    152

    787

    191

    76

    6008

    152

    203

    864

    254

    102

    7510

    191

    254

    1041

    318

    127

    0912

    229

    305

    1245

    381

    152

    01014

    267

    356

    1372

    445

    178

    01215

    305

    381

    1422

    508

    203

    01518

    381

    457

    1626

    635

    254

    1820

    457

    508

    2032

    762

    305

    2122

    533

    559

    2083

    889

    356

    2424

    610

    610

    2362

    1016

    406

    .. Please consult our sales department for more sizes

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    RIBBON WEDGES

    Suitable for bonding alloy tape, aluminum tape and other wire.

    WEDGES size table

    Ribbon width

    Ribbon thick

    unit(u m)

    12.7um

    25.4um

    50um

    A1

    B1

    75um

    A2

    B2

    100um

    A3

    B3

    125um

    A4

    B4

    150um

    A5

    B5

    200um

    A6

    B6

    250um

    A7

    B7

    300um

    A8

    B8

    .. Please consult our sales department for more sizes

    TS+BL

    FR Leading foot

    BR Rear guide foot

    TW hole width

    TW Hole height

    T Length of tool head

    A120

    25um

    8um

    50um

    75um

    126um

    A220

    25um

    8um

    65um

    75um

    126um

    B325

    25um

    8um

    65um

    75um

    190um

    B330

    25um

    8um

    90um

    176um

    190um

    B350

    25um

    8um

    100um

    340um

    380um

    ... All sizes are for reference only, more details can contact our sales

    WEDGE Personalized customization

    The following shown various problem situations that can occur during bonding and their solutions.

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