Semiconductor Packaging Process Bonding Wedge

Description

The splitter, also known as the steel nozzle and the vertical needle, is an important component of lead bonding in the semiconductor packaging process, which generally includes cleaning, device chip sintering, lead bonding, sealing cap and other processes. Lead bonding is a technology to realize the electrical interconnection and information intercommunication between the chip and the substrate. The splinter is installed on the lead bonding machine. Under the action of external energy (ultrasonic, pressure, heat), through the plastic deformation of metal and the solid phase diffusion of atoms, the lead wire (gold wire, gold strip, aluminum wire, aluminum strip, copper wire, copper strip) and the bonding pad are formed. To achieve the interconnection between the chip and the circuit.